Pore ??filling machine main achievement of the multi-layer substrate manufacturing process by pressing down on the adsorption filling mode, after the completion of drilling ceramic diaphragm metal paste filling the through-hole, reaching the purpose of conducting electrical interconnection. The device detects the image to enlarge Mark points separately adjusted by one thousand bits, complete the positioning servo system and scraping pressure. Stage porous ceramic plate. PLC control, to complete the manufacturing process step of filling pores. Technical parameters: 1, filling the area: 150mm × 150mm 2, filling way: Shaving head extrusion method and vacuum suction method 3, vacuum platform: a porous ceramic plate 4, positioning adjustment: the image detector, micrometer adjustment of the position. 5, fill the hole Screen Size: 450mmX450mm 6, film thickness: (0.05 ~ 1) mm 7, fill hole diameter: Φ0.2 ~ Φ4 8, duty cycle (minimum): 20s / pcs 9, power supply: single-phase 220 × (1 ± 10%) V 50 / 60Hz 10, gas source: (0.5 ~ 0.7) MPa 11, Power: ≤1kW 12, Dimensions: approximately 1200 (L) mm × 1000 (W) mm × 1700H) mm three the principles and structure of the machine adopts PLC programmable controller as the control, the image displayed on the position adjustments, mainly the implementation of components are imported from Japan, fast response and high reliability.